Job Description
Job Responsibilities:
- Perform epoxy and die eutectic attachment
- Perform epoxy and substrate eutectic attachment.
- Perform ribbon and wire bonding processes on a variety of machines
- Perform mechanical assembly utilizing hand tools and equipment
Job Requirements:
- High School Diploma or equivalent
- 2 to 4 years of assembly experience under a microscope
- Ability to read, understand and interpret drawing specifications and follow established procedures to assemble products.
- Be able to work under a microscope for 6 to 8 hours a day assembling microelectronics in a clean room environment.